PBGA / CSP package substrate production supporting
Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, ASICs, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF, others;
PBGA (Plastic Ball Grid Array)
PBGA has the characteristics to connnect Chip to the Substrate and encapsulate it by plastic-type molding compound, place solder ball partly or entirely in lattice-shaped.PBGA has 2-4 layer substrate structure to have solder ball pad pitch 1.0~1.5㎜, solder ball counts ~1156, package size 13~40㎜. There could be some substrates that need impedance control depending on the Chip's characteristics.
Spec.of Substrate production:
Mini.Line space/width:1mil (20/20um,25/25um)
Finished thickness:0.25mm;
Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;
Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;
Copper:0.5oz or Customize;
Layer:1-6 layer (Customize);
Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)
Short introduction of Horexs Manufacturer:
HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.
When you send inquiry us,Pls be know that we have to get the following :
1-Substrate production sepc. information;
2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)
3-Quantity request,Including sample;
4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!
Want Better price,Better quality Substrate ? Contact Horexs now!
Shipping supporting:
DHL/UPS/Fedex;
By air;
Customize express(DHL/UPS/Fedex)
Product Tags:
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Green PBGA / CSP Package Substrate 0.3mm Thickness BT Material For IC Assembly Images
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