FCCSP package substrate production supporting

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally,
the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC
components. It is one of the most key materials of the IC packaging, and the share of IC substrate.

Application

• IC assembly
• Mobile phone
• Smart phone
• Digital camera electronics
• Semiconductor package
• IC package
• Consumer electronics
• Computer,others;

Applicable up to 35µm pitch for flip-chip assembly (peripheral)
Thin build-up laminate for SiP applications (0.3mmt for 1-2-1)
Applicable environmentally-friendly products (Halogen-free, Lead-free)
Various surface finish options are available
(Au plating, Lead-free solder coating, OSP, etc.)

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.3mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

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